Winbond Electronics Corporation is a leading supplier of semiconductor solutions to the consumer, computer, communications, and electronics product markets. Winbond developed the mobile DRAM devices with a low IDD current value, which helps Winbond to extend mobile DRAM memory applications beyond the mobile phone and tablet market to areas of mobile consumer electronics and mobile communication. Winbond mobile DRAM devices support both x16 and x32 data widths. Major features for the families of products shown in the table below include the following: Sequential or Interleave burst、High Clock rate、Standard Self Refresh、Partial-Array Self Refresh (PASR)、Automatic Temperature Compensated Self Refresh Rate(ATCSR)、Deep Power-Down (DPD)、and Programmable output buffer driver strength. Please refer to the datasheets for specific features. They are ideal for portable multimedia players, wearable devices, automotive applications, consumer electronics, gaming devices, and mobile devices.
Product Category
Product Lines | Density | Voltages | Data Width |
---|---|---|---|
PSRAM | 64Mb and 256Mb | 1.8V/1.8V | x16 |
HYPERRAMTM | 32Mb~512Mb | 1.8V, 3V | x8 for 32Mb~512Mb x16 for 128Mb1 and 256Mb |
LPSDR SDRAM | 128Mb~512Mb | 1.8V/1.8V | x16, x32 |
LPDDR1 SDRAM | 128Mb~1Gb | 1.8V/1.8V | x16, x32 |
LPDDR2 SDRAM | 256Mb~2Gb | 1.8V/1.2V | x16, x32 |
LPDDR3 SDRAM | 1Gb | 1.8V/1.2V | x16, x32 |
LPDDR4 SDRAM | 2Gb~4Gb | 1.8V/1.1V/1.1V | x16, x32 |
LPDDR4X SDRAM | 2Gb~4Gb | 1.8V/1.1V/0.6V | x16, x32 |
KGD | Product Type Dependent |
Note:128Mb, x16 only available on KGD. Please contact Technical Support if need further product information.