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Known Good Die (<span class="match">KGD</span>) Several customers utilize Winbond’s expertise in using flash products in Known Good Die (<span class="match">KGD</span>) for SIP (System In Package) solutions. Flash dies are stacked with Controller dies and put in a single package or module to provide SIP solutions. <span class="match">KGD</span> of other devices can also be stack...

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Winbond leverages advanced manufacturing processes to provide high-quality, high speed, and wide temperature range Known Good Die (<span class="match">KGD</span>) wafers. We also offer electrical simulation, wafer-level speed testing, and other services to enhance product compatibility with SOC for <span class="match">KGD</span> customers. Many custome...

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https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA03-UBG045_2.html&level=2

Winbond launchs 32bit 32M/64Mb SDR/DDR <span class="match">KGD</span> for SiP application Winbond Electronics Corporation (WEC) today announced the launch of its latest 32bit bandwidth 32M/64Mb SDR / DDR DRAM memory which is built on its 65nm bWL process for SiP (System in Package) application. This new product is able to pro...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-launchs-32bit-sdr-ddr-kgd-for-SiP-application.html?__locale=en

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA01-AN0000032.html&level=2

Winbond’s 256Mb HyperRAM 2.0e <span class="match">KGD</span> (Known Good Die) provides the Efinix® Titanium Ti60 F100 FPGA with the performance, low power consumption and small size needed for embedded AI applications at the edge Requiring only 22 signal pins versus the standard 31-38 needed by legacy DRAM, Winbond’s HyperRAM...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/efinix-selects-winbond-hyperram-to-drive-a-new-generation-of-compact-ultra-low-power-ai-and-iot-devices.html?__locale=en

Winbond’s HyperRAM™ product offers attractive combination of low pin count, low power consumption and high data bandwidth in miniature <span class="match">KGD</span> form factor TAICHUNG, Taiwan – January 13, 2021 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced t...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/gowin-embeds-winbond-64mb-hyperram-for-ai-edge-computing.html?__locale=en

TAICHUNG, Taiwan– 2023-02-15 –Winbond has joined the UCIe™ (Universal Chiplet Interconnect Express™) Consortium, the industry Consortium dedicated to advancing UCIe technology. This open industry standard defines interconnect between chiplets within a package, enabling an open chiplet ecosystem and ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_ucie_consortium_highperformance_chiplet_standardisation.html?__locale=en

(Pleasanton, CA, and Taichung, Taiwan – June 16, 2020) – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a new version of QspiNAND Flash designed for use with the Qualcomm® 9205 LTE Modem. The industry’s first 1.8V, 512Mbits (64Mega Bytes...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-a-new-qspinand-flash-for-use-with-qualcomm-9205-lte-modem.html?__locale=en

The W25QxxND 1.2V series of Serial NOR Flash has performance identical to the popular 3V and 1.8V families of serial flash with the added benefit of saving power. Packages offered: 2mm x 3mm USON8 narrow 150mil SOP8 6x5mm WSON 8-pin <span class="match">KGD</span> (Known Good Die) The packages offered provide designers with th...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/1.2v-serial-nor-flash/index.html?__locale=en