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Winbond’s TrustME® Secure Flash Memory offers robust code and data storage protection through external Secure Flash Memory, enhancing system trusted boot and firmware update reliability. In today’s security-conscious era, providing reliable solutions for trusted boot and firmware updates has become ...

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TAICHUNG, Taiwan – October 24, 2017 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustME® Secure Flash products portfolio aligned with Platform Security Architecture (PSA) from Arm. As the industry’s first Common...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-trustme-secure-flash-aligned-with-arm-psa.html?__locale=en

https://www.winbond.com/productResource-files/Winbond%20TrustME%20Secure%20Flash%20Product%20Brief.pdf

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With CC EAL2 and ISO26262 ASIL-C Ready certifications, W77Q Secure Flash will help IoT and automotive manufacturers to design systems using Secure Flash in compliance with security and functional safety standards simultaneously. TAICHUNG, Taiwan—2021-8-11–Winbond Electronics Corporation, a leading g...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-trustme-w77q-secure-flash-common-criteria-eal2-iso26262-asld-c-ready-certification.html?__locale=en

(Taichung, TAIWAN – 26 February, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that the TrustME® W75F Secure Flash Memory has achieved PSA Certified™ Level 2 Ready in the PSA Certified independent security assurance scheme. Now...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-trustme-secure-flash-memory-achieves-psa-certified-level-2-ready.html?__locale=en

https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=en

TAICHUNG, Taiwan – October 24, 2017 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustME® Secure Flash products portfolio based on the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Arc...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-trustme-secure-flash-implementing-the-tcg-dice-architecture.html?__locale=en

With SESIP level 2 certification, W77Q Secure Flash will provide connected devices a higher level of assurance by simultaneously requiring a vulnerability analysis and actual penetration testing on IoT platform design systems using Secure Flash in compliance with security and functional safety stand...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/Winbond-TrustME-W77Q-Secure-Flash-Obtains-SESIP-Level-2-with-Physical-Attacker-Resistance-Certification.html?__locale=en

TAICHUNG, Taiwan – 2021-12-13 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today that TrustME® W77Q Secure Flash has been selected as the winner of 2021 Elecfans IoT Technology Innovation Awards. Established by Elecfans, a well-known leadi...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_trustme_w77q_2021_china_elecfans_iot_awards.html?__locale=en

AICHUNG, Taiwan—2022-11-17 Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today that TrustME® W77Q Secure Flash has been selected as the winner of China OFweek 7th IoT& AI Innovative Technology Product Awards 2022. Established by OFweek, a wel...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_trustme_w77q_wins_ofweek_china_iot_innovation_awards_2022.html?__locale=en